The persistent challenge of overheating in compact electronics may have met its match. xMEMS, a California-based company specializing in micro-electromechanical systems (MEMS), is adapting its groundbreaking “chip fan” technology to tackle thermal issues in next-generation smart glasses.

As smart glasses integrate more powerful processors and advanced AI features, managing heat has become a critical bottleneck. Traditional mechanical fans, which are often noisy, prone to vibration, and bulky, are ill-suited for the sleek, lightweight form factor required for wearable glasses. xMEMS’s µCooling chip offers a solid-state solution. This tiny silicon component, measuring just 9.3mm × 7.6mm × 1.13mm, operates silently and without moving parts.

The company claims its technology can enable smart glasses to use 60% to 70% more power before hitting thermal limits, simultaneously lowering the device’s surface temperature by up to 40% and reducing thermal resistance by 75%. “Heat in smart glasses not only impacts performance but is directly tied to user comfort and safety,” said Mike Housholder, Vice President of Marketing at xMEMS. He emphasized that their µCooling technology is the only active cooling solution small and thin enough to fit within the frame of glasses for true all-day wearability.

The potential of active cooling is also being explored in the smartphone industry. According to a report from Futu News, manufacturers like Huawei and OPPO are actively testing “built-in fan” active cooling systems and advanced liquid cooling solutions for their devices. This signals a broader industry trend where effective heat dissipation is becoming a key differentiator for performance in compact electronics.

xMEMS is currently providing samples to manufacturers and expects to begin mass production of its µCooling chips in early 2026, paving the way for a new generation of more powerful and comfortable wearable devices.